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Heatsinks
HEATSINKS
Power Assemblies
DS5404-1.0 November 2000
The current range of heatsinks is illustrated with a brief resume of their characteristics. The products available are intended for use with all our power semiconductors - from the small stud base through to large disc devices and modules.
All heatsinks are suitable for Natural Air Cooling (AN) and Forced Air Cooling (FC). In addition to a vast experience of AN and FC cooling methods we also have many years experience in liquid and phase change cooling. A range of coolers for 17mm to 100mm silicon diameter devices is available, as is a range of associated clamps.
AIR COOLED HEATSINKS
All dimensions shown in mm unless stated otherwise.
0.5 0.48
THERMAL RESISTANCE (C/W)
0.15
THERMAL RESISTANCE (C/W)
0.46 0.44 0.42 0.4 0.38 0.36 0.34 0.32 0.3 125 175 225 275 325 375 HEATSINK LENGTH (mm) 200W
0.145
0.14
0.135
0.13
77.5
M8 slots
0.125 200W 0.12 125 165 205 245 285 HEATSINK LENGTH (mm)
27 175
Cross sectional area (cm2): 52.3 Weight kg/m: 141.2
Air natural
0.44
THERMAL RESISTANCE (C/W)
THERMAL RESISTANCE (C/W)
Forced air (5m/s)
0.1
Heatsink profile: ED
M6 slot 222 1
0.42 0.4 0.38 0.36 0.34 0.32 200 W 0.3 125 175 225 275 325 375 HEATSINK LENGTH (mm)
0.095
0.085
0.08 200W
50
0.075 125
175 225 275 325 375 HEATSINK LENGTH (mm)
Cross sectional area (cm2): 124.08 Weight kg/m: 31
Air natural
Forced air (5m/s)
Heatsink profile: EM
M8 slots
0.09
120
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Heatsinks
THERMAL RESISTANCE (C/W)
Notes: 1. Thermal ratings are given per heatsink. 2. Comprehensive data is available for all our heatsinks to support all design applications. 3. Black anodising is available on all air cooled heatsinks for surface protection and enhanced performance.
1.4 1.3 1.2 1.1
M6 slots 67
0.9 0.8 0.7 80W 0.6 60 80 100120140160180200220 HEATSINK LENGTH (mm)
90
1.0
M8 slot Cross sectional area (cm2): 26.21 Weight kg/m: 7.1
Air natural
Heatsink profile: EH
WATER COOLED HEATSINKS
Water cooled heatsinks are designed for use in high current, high power assemblies such as single,
0.04
three or six phase bridges or A.C. controllers. Complete bridges of up to six devices may be constructed.
2 heatsinks for double side cooling, thermal resistance heatsink surface to water inlet.
All dimensions shown in mm unless stated otherwise.
THERMAL RESISTANCE (C/W)
0.035
0.03
0.025
0.02
0.015 1
2
3
4 5 6 7 WATER FLOW (L/m)
8
9
10
Type code: D
0.03
THERMAL RESISTANCE (C/W)
0.028 0.026 0.024 0.022 0.02 0.018 0.016 0.014 0.012 1 2 3 4 5 6 7 WATER FLOW (L/m) 8 9 10
Type code: K
Note: 1. For details of water connections, please contact factory.
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Heatsinks
0.032
THERMAL RESISTANCE (C/W)
0.03
0.028 0.026 0.024 0.022 0.02 1.5 2 2.5 3 3.5 4 4.5 WATER FLOW (L/m) 5 5.5 6
0.018 1
Type code: Y
0.03 THERMAL RESISTANCE (C/W) 0.028 0.026 0.024 0.022 0.02 0.018 0.016 0.014 0.012 1 2 3 4 5 6 7 WATER FLOW (L/m) 8 9 10
Type code: P
0.024
THERMAL RESISTANCE (C/W)
0.022 0.02 0.018 0.016 0.014 0.012 1
2
3
4 5 WATER FLOW (L/m)
6
7
8
Type code: E
THERMAL RESISTANCE (C/W)
0.0205 0.0185 0.0165 0.0145 0.0125 0.0105 0.0085 1 2 3 4 5 6 7 WATER FLOW (L/m) 8 9 10
Type code: L
Note: 1. For details of water connections, please contact factory.
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Heatsinks
0.0175
THERMAL RESISTANCE (C/W)
0.0165 0.0155 0.0145 0.0135 0.0125 0.0115 0.0105 0.0095 0.0085 1 2 3 4 5 6 7 WATER FLOW (L/m) 8 9 10
Type code: F
0.0155
THERMAL RESISTANCE (C/W)
0.0145 0.0135 0.0125 0.0115 0.0105 0.0095 0.0085 0.0075 1 2 3 4 5 6 7 WATER FLOW (L/m) 8 9 10
Type code: M
Note: 1. For details of water connections, please contact factory.
ASSOCIATED PUBLICATIONS
Title Heatsink requirements for IGBT modules Calculating the junction temperature of power semiconductors Guidance notes for formulating technical enquiries Recommendations for clamping power semiconductors Application Note Number AN4505 AN4506 AN4869 AN4839
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Heatsinks
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACS range includes a varied selection of pre-loaded clamps to suit all of our manufactured devices. Types available include cube clamps for single side cooling of `T' 23mm and `E' 30mm discs, and bar clamps right up to 83kN for our `Z' 100mm thyristors and diodes. Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies. Please refer to our application note on device clamping, AN4839
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer service office.
http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES Central Europe Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 46 38 51 33. North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020. SALES OFFICES Central Europe Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 46 38 51 33. North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020. These offices are supported by Representatives and Distributors in many countries world-wide. (c) Dynex Semiconductor 2000 Publication No. DS5404-1 Issue No. 1.0 November 2000 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
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